SiCarrier of China Shocks Chip Industry with Comprehensive Chip Equipment Lineup at SEMICON 2025, Challenging ASML’s Market Lead

China’s leading chip equipment firm, SiCarrier, has introduced an impressive array of tools aimed at significantly advancing the nation’s semiconductor manufacturing capabilities.

In a move that is shaking up the global semiconductor industry, China’s SiCarrier stands out as the country’s premier manufacturer of chip-making equipment, posing a formidable challenge to major players like ASML. China’s semiconductor industry has seen remarkable growth as the country seeks to establish its independence from foreign influence. Key companies such as Huawei and SMIC have been pivotal in this effort, laying down the infrastructure required for domestic chip production. However, SiCarrier, reportedly supported by Huawei, often goes unrecognized despite its specialized expertise in creating tools essential for chip manufacturing. During the SEMICON 2025 event held in China, SiCarrier showcased its latest collection of equipment, signaling their determined push forward.

At the recent SEMICON event, notable tech enthusiast @zephyr_z9 shared insights from SiCarrier’s latest offerings, which include state-of-the-art RTP (Rapid Thermal Processing) systems utilized in IC device manufacturing. While the catalog lacks lithography tools, it hints at SiCarrier’s focus on staying competitive in areas dominated by giants such as ASML and Applied Materials. The effectiveness of these new tools in the local market is yet to be fully assessed.

During the event, an image courtesy of SCMP highlighted this technological showcase, underscoring the significance of these advancements. SiCarrier’s President, Du Lijun, addressed the capability of their equipment to fabricate 5nm chips. However, the reliance on non-optical technologies may present yield rate challenges, potentially increasing production costs relative to international options. Nevertheless, SiCarrier is collaborating closely with SMIC and Huawei to tackle these hurdles, with hopes for a major breakthrough in China’s pursuit of chip production self-sufficiency.

Du Lijun, in conversation with Reuters, suggested, “There could be solutions using non-optical methods, utilizing our equipment to tackle some lithography challenges.” This quote reflects the innovative spirit driving SiCarrier’s efforts.

SiCarrier’s overarching goal is to shift the semiconductor landscape away from dependency on nations such as the Netherlands, a key supplier of critical chip-making technologies. Previously, it was reported that SiCarrier is engaged with Huawei and the Shenzhen government to develop custom EUV prototypes focusing on laser-induced discharge plasma (LDP). This initiative marks a pivotal step for China in building its EUV lithography capabilities, a critical component in achieving groundbreaking advancements in semiconductor technology.

In sum, SiCarrier’s newly unveiled technologies not only position them as a significant player in the global industry but also mark an important milestone in China’s ambition to achieve technological self-reliance.